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SIM Card Connector,PUSH PUSH,6P,H1.85mm,without Post Material:
Housing:Hi-Temp Plastic,UL94V-0.Rated.
Contact:Copper Alloy.
Shell:Stainless Steel.SUS 301,T=0.20mm.
Plating:
Contact area:G/F Plated over 30u" Nickel
Solder area:80u" Tin Plated over 30u" Nickel.
Under plate:30u" Min Nickel.
Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash.
Electrical:
Current Rating:0.5 A
Dielectric Withstanding Voltage:250V AC/DC.
Insulation Resistance:500MΩ Min.
Contact Resistance:100mΩ Max.
Mating Cycles:5000 Insertions.
Operating Temperature: -45ºC~+85ºC
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Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |